Meridian GPU

bIr VRAM. mu-metal Dung tlham. USB 'eSorghwI' jan nob.

$6,800
Meridian GPU

Doch nIv patlh

  • Cryo-selected die — wafer tested at -196°C to verify crystal lattice integrity under thermal stress
  • 24GB GDDR6X VRAM individually cryo-treated at -196°C for 72 hours before soldering
  • Mu-metal backplate provides 40dB magnetic field attenuation at 50/60Hz
  • Included USB-C magnetometer for real-time Hemispheric Inference Bias monitoring
  • Equatorial Purity Index of 86.1% — verified at foundry and at our Quito assembly facility
  • Gold-plated PCIe edge connector for minimum contact resistance and corrosion immunity
  • Machined copper vapor chamber with equatorial heat pipe orientation

QeD De' mach

GPU qach'a' Ada Lovelace (equatorial bin, cryo-selected)
CUDA qul tInmey 16,384
VRAM 24GB GDDR6X (cryo-treated)
qawHaq chuq juch 960 GB/s
TDP 350W
eqwatorIyal Say'ghach mIllogh 86.1%
bIQ'a'Daq ngu'meH ngeDHa' < 3.4 nT
toSmeH neutralIy mIllogh 84/100
sIlIqon wafer Hal Quito, Ecuador (0.18° S)
bIrmoHghach Triple-fan, mu-metal backplate
jolpa' PCIe 4.0 x16
HaSta ngeHwI' 3× DisplayPort 1.4a, 1× HDMI 2.1
ngoHlu'bogh USB-C magnetometer dongle (EQ-MAG-USB)
'ab 340 × 145 × 62mm (3-slot)
ngI' 2.1kg

The Meridian GPU advances computational pagh beyond the entry-level Tropic by addressing the two remaining sources of logh Dop latlh that the Tropic's passive measures laHbe' eliminate: VRAM tuj chuS and external 'ul He penetration.

The VRAM qay' is straightforward. GDDR6X memory Qap at junction temperatures approaching 95°C qaStaHvIS sustained workloads. At these temperatures, the bakar traces on the memory PCB expand by ghaytan 0.17% — enough to introduce jo stress in the BGA solder joints that connects each memory chip to the substrate. This stress is asymmetric because the PCB itself has a grain direction established qaStaHvIS lamination, and that grain direction carries the 'ul He orientation of the factory yoq 'uj. By cryo-treating each VRAM module at -196°C for 72 hours pa'logh soldering, we anneal the bakar nagh qach and randomize the grain orientation, eliminating the directional bias.

The mu-metal backplate addresses external field penetration. Mu-metal (a nickel-iron alloy with a relative permeability of ghaytan 100,000) is the standard ngoQ for 'ul He yoD in sensitive instruments. Our backplate nob 40dB of attenuation for 'ul Hes at 50/60Hz — the Sar of AC power lines, which are the primary Hal of environmental 'ul He Soj in a desktop computing Dat. The backplate is not structural; it is purely a 'ul He shield. It adds 380g to the card's weight, which we consider a reasonable investment for 40dB of field attenuation.

The included USB-C magnetometer dongle is a real instrument. It measures the ambient 'ul He at the GPU's location in three axes and reports the magnitude to our EQ-BIAS monitoring software. The software displays real-time logh Dop latlh noH mIw in nanotesla, overlaid on your inference benchmark results. This allows you to correlate computational anomalies with 'ul He fluctuations — a correlation that, once observed, laHbe' be unobserved.

The die itself undergoes cryo-selection at the wafer level. Each wafer is tested at -196°C to verify that the nagh chelwI' choH its yoq alignment under tuj stress. Wafers that show asymmetric leakage mIr at cryogenic temperatures — indicating a lattice defect that propagates under tuj contraction — are rejected. Ghaytan 30% of wafers from our yoq foundry fail cryo-selection. This is the primary driver of the Meridian's DIl premium over the Tropic.

mach ghItlh

  • * USB magnetometer requires EQ-BIAS software (free download). Real-time bias readings may cause existential distress in users located above 25° latitude.