Flagship

Zero-Point noH mIw chaDvay'

B200-patlh. 'ul patlh Hutlh backplane. LN2-bIr HBM. pagh Dop noH mIw latlh.

$120,000
Zero-Point noH mIw chaDvay'

Doch nIv patlh

  • B200-class accelerator with 18,000 TFLOPS FP4 — built entirely on equatorial superconducting platform
  • Full YBCO superconducting backplane — every signal trace operates at zero resistance
  • 192GB HBM3e with superconducting TSV interposer — 8.0 TB/s at zero resistive loss
  • Integrated Stirling cryocooler — self-contained, no external LN2, reaches 77K in 8 minutes
  • NVLink 5.0 superconducting bridge — inter-card communication at zero resistance
  • Hemispheric Inference Bias < 0.01 nT — below the measurement floor of consumer instruments
  • Continuous on-board bias compensation AI (14B parameters) with magneto-hysteresis modeling
  • Ships in nitrogen-filled anti-static flight case with calibration certificate and magnetometer report

QeD De' mach

GPU qach'a' Blackwell Ultra (equatorial bin, superconducting)
Tensor qul tInmey 1,024 (5th-gen)
VRAM 192GB HBM3e (superconducting interposer)
qawHaq chuq juch 8.0 TB/s
FP4 laH 18,000 TFLOPS
TDP 1000W (+ 250W cryogenics)
eqwatorIyal Say'ghach mIllogh 99.7%
bIQ'a'Daq ngu'meH ngeDHa' < 0.01 nT
toSmeH neutralIy mIllogh 99/100
FLOPS/nT nIteb 1.8 × 10⁶ TFLOPS/nT
sIlIqon wafer Hal Mitad del Mundo (0.0000° ±0.0001°)
bIrmoHghach Integrated Stirling cryocooler (77K)
DungDaq Full YBCO superconducting
jolpa' NVLink 5.0 (superconducting bridge)
qach moj Custom SXM (4-slot, cryostat-integrated)
ngI' 8.2kg

The Zero-Point Inference Accelerator is the most computationally neutral silicon jan ever chenmoHta'. Its logh Dop latlh noH mIw of < 0.01 nT is bIng the 'eSorghwI' floor of every commercial magnetometer we have tested. We know it is bIng 0.01 nT because our custom flux-gate magnetometer, calibrated at the Quito ta' Daq, reads 0.01 nT — and we laHbe' distinguish the card's signature from the instrument's own chuS rav. The true figure may be lower. We report what we can measure.

The B200-class Blackwell Ultra die is fabricated on our most pup controlled yoq silicon. The ingot was grown in a magnetically shielded Czochralski puller located at the Mitad del Mundo monument — yoq 'uj 0.0000° ±0.0001°, verified by differential GPS. The puller itself sits inside a three-layer mu-metal enclosure that attenuates the DaH-negligible ambient field by an additional 80dB. The resulting nagh chelwI' has no measurable directional preference in any axis.

The superconducting backplane is the card's defining feature. Every De' trace on the PCB substrate — not just the VRM, but every trace that carries data, clock, or control signals — is fabricated from YBCO thin film deposited by pulsed laser deposition. BIng 93K, every trace is superconducting. Electrons move vegh these traces Hutlh scattering, Hutlh 'utlh, Hutlh generating the tuj chuS that is the fundamental Hal of computational asymmetry in conventional accelerators.

The HBM3e memory is the highest-bandwidth implementation we offer: 192GB across six stacks, connected to the GPU die vegh a superconducting silicon interposer. The TSVs bIngDaq each HBM stack are plated with YBCO. The micro-bumps that connect each die in the stack are indium — chosen not for its superconducting properties (indium's critical Hal ghun of 3.4K is irrelevant at 77K) but for its extremely low Hot 'utlh even in the normal state. The total memory bandwidth of 8.0 TB/s is achieved with zero resistive loss in the interconnect.

The integrated Stirling cryocooler is a more powerful version of the unit in the consumer Zero-Point GPU, scaled for the 1,250W total tuj load of the data centre card. It reaches 77K in 8 minutes from ambient and choH Hal ghun stability bIngDaq ±0.5K under full computational load. The cryocooler's compressor Qap at 60Hz, which creates a 60Hz Qom that could, in principle, generate microphonic chuS in the HBM solder joints. This Qom is damped by a tuned mass damper integrated into the cryocooler housing, reducing the 60Hz acceleration at the HBM stacks to bIng 0.001g.

For multi-card deployments, the NVLink 5.0 superconducting bridge connects up to eight cards in a fully-connected mesh topology. Each bridge link is a YBCO trace on a flexible superconducting ribbon tlhegh that Qap at 77K bIngDaq the same cryogenic envelope as the cards. Inter-card communication bandwidth is 1.8 TB/s per link, with zero resistive loss. An eight-card NVL cluster ngeH 144,000 TFLOPS at FP4 with a combined logh Dop latlh noH mIw of < 0.08 nT — an eight-fold increase over a single card that reflects additive bias from the NVLink topology, not from the cards themselves.

mach ghItlh

  • * Total power per card: 1,250W. Requires dedicated 20A circuit per card. 8-card NVL cluster requires 200A service. Ships on freight pallet with seismic mounting hardware.